Thermal Paste Conductivity Calculation

It is very accurate but takes a significant amount of time to.

Thermal paste conductivity calculation.

I took 0 1mm as a wild guess. Or select a value from our material database. I m trying to calculate the thermal paste joint between my pcb and the heatsink. The pcb thermal calculator helps you estimate the junction temperatures of components which use exposed pad packages.

Input the cross sectional area m 2 add your materials thickness m enter the hot side temperature c enter the cold side temperature c. How does the heat transfer conduction calculator works. A tube of 8 5w mk carbon based compound which is. The parameters used to calculate thermal conductivity are the steady state temperatures the heat used for the warmer plate and the thickness of the material.

But heat sink will be glued using thermal glue like hc910 which has thermal conductivity of 1 7 w m k. The heat transfer conduction calculator below is simple to use. I found in the manufacturers datasheet is has a thermal conductivity of 1 6w mk watt meter kelvin. Enter the thermal conductivity of your material w m k.

Thermal paste also called thermal compound thermal grease thermal interface material tim thermal gel heat paste heat sink compound heat sink paste or cpu grease is a thermally conductive but usually electrically insulating chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices. So rglue thickness area k k thermal conductivity. I my case area is 0 01m 0 009m 0 0000054 sq m k is 1 7 and i have no clue what thickness will be. Price is normally set based upon thermal conductivity and the amount of compound in the tube generally in the range of 3g which is a few uses.

It can be used for temperature ranges of 80 1500 k and for materials such as plastic glass and insulation samples. I need to calculate thermal resistance of glue layer. This tool generates a quick estimate of the expected junction temperature based on the copper spreading area on the pcb. For example the thermal conductivity of a high grade thermal paste is 8 5 w mk and the heat conductivity of copper is 385 w mk or for aluminum 205 w mk.

Whilst all other data i have for the heatsink is in c w. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. You can see that the thermal compound is actually a poor heat conductor and that is exactly the reason why you only need a very thin layer of paste to fill the micro imperfections between.