Thermal Interface Material

Thermal interface materials provide a thermal path between the heat source and heat sink.

Thermal interface material.

Indium corporation is a leader in the development of both solder and metal based thermal interface materials tim for a wide variety of applications. Aoki r and chiu c p a testing apparatus for thermal interface materials proceedings of 1998 international symposium on microelectronics san. Honeywell tims are based on proprietary technologies of polymer matrices and thermally conductive fillers enabling them to handle challenging heat dissipation issues. Thermal interface materials tims are widely employed to manufacture the most critical parts in the heat dissipation system to cool and protect integrated circuit ic chips.

Thermal interface materials the dissipation of heat is the key to maintaining longevity and reliability of semiconductor and power devices. Irvine california henkel today announced the expansion of its award winning thermal interface materials tims portfolio with the addition of a product developed to address the high power density challenges associated with new 5g telecom infrastructure and consumer mobility designs. As an industry leader in high performance cost effective thermal interface materials tims and technologies laird designs and manufactures thermal products including gap fillers and putties phase change materials thermal greases and thermally conductive insulator materials that meet the demands interface materials tims and technologies laird designs and. A thermal interface material shortened to tim is any material that is inserted between two components in order to enhance the thermal coupling between them a common use is heat dissipation in which the tim is inserted between a heat producing device e g.

Thermal interface materials are designed to help remove the heat generated by an electronic device to the ambient environment to ensure reliable operation of electronic hardware communication equipment and portable electronics. And matayabas j thermal contact resistance of cured gel polymeric thermal interface material submitted to ieee transactions on components and packaging technology 2003. Typically a tim is specific to materials dispensed in very thin bond lines and dispensed directly onto individual electronic components or between a heat spreader and a heat sink. Hitherm tims are made of flexible graphite specifically engineered for demanding lighting computing and power electronics applications.

An integrated circuit and a heat dissipating device e g. Thermal interface materials tims are a category of products used to aid thermal conduction between mechanically mated surfaces such as a semiconductor device and a heat sink.