Thermal Epoxy Heat Sink

These highly effective thermal interface materials contain special alumina boron nitride silica aluminum nitride fillers or particles to improve device reliability and longevity.

Thermal epoxy heat sink.

One part oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. This thixotropic adhesive provides high temperature bonds to a variety of substrates. In addition to providing strong bonds and thermal conductivity the 70 3812nc passes nasa s outgassing requirements per astm e 595 07. These thermal tapes provide excellent long term reliability electrical insulation and flame retardant performance.

This range of high adhesion thin thermal tapes offers bonding strength and efficient heat dissipation for applications such as heat sink mounting and led lighting thermal management. The 70 3812nc aluminum filled epoxy adhesive has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds. The viscosity of this material is ideal for bonded fin heat sink applications and pipe bonding in extruded aluminum base applications. The liqui bond product line also offers mild elastic properties which assist in relieving cte mismatches.

One and two component thermally conductive epoxy and silicone compounds are employed for bonding heat sinks to electronics components and circuit boards to dissipate heat. Serviceable from 4k to 400 f. 50 3186 nc is a two part thermally conductive epoxy adhesive. 3m thermal transfer tapes are available in a variety of thicknesses to meet your most challenging thermal applications.

These customizable liquid tapes pads or a mix means reliable high thermal performance less waste and just in time supply.